Design Flexibility at Commercially Relevant Scales

Chemical Isoimidization Process for Advanced Polyimide Designs

    • Increased monomer scope to broad range of dianhydrides and diamines
    • Broad process solvent compatibility
    • Room temperature processing and lower temperature cure (<250 oC)
    • Lower energy demands
    • Low shrinkage imidization and reduced film stress
    • Void-free curing process for polyimide films
    • Low defect films with fewer pinholes and blisters

Halocarbon Isoimidization Process Agents Give You the Advantage

Halocarbon Electronics SolutionsHalocarbon Process Chemicals for Advanced Polyimide Designs