By Jason Spruell Innovative technologies are driving advances in the semiconductor packaging industry resulting in exponential growth of the number input/outputs (I/Os), modular designs for greater economies of scale, thinner and smaller chip packages. The key packaging technology is known as Fan-Out Wafer Level Packaging (FOWLP) in which the input/outputs (I/O) are “fanned-out” from the
By Jason Spruell For over 55 years, the semiconductor industry has continued down the path of unrelenting miniaturization as described by Moore’s Law. A majority of this time has been devoted to advancing photolithographic processes to create ever-decreasing feature sizes on logic processors and memory chips. From i-line and 248 nm, to 193 and 193
With growing concerns surrounding the global warming emissions related to semiconductor manufacturing, the electronics industry faces a unique challenge. The demand for more environmentally friendly practices has driven the development of alternatives to traditional materials for use in the removal and cleaning of dielectric films and metal contaminants on the surface of semiconductor wafers. The
By: Jason Spruell Polyimides as a Versatile Platform Polyimides are an important class of polymeric materials that are used in a wide variety of applications ranging from filtration membranes and aerospace composites electronics-grade coatings and adhesives. Polyimides are known to have excellent chemical resistance, mechanical properties, and high temperature performance. For this reason, polyimides are
Flexible displays are entering the markets at an accelerating rate. These displays are revolutionizing user experience through high-performance organic light-emitting diodes (OLEDs) with the ability to bend and fold to enable significant advancement in the touchscreen industries, including smartphones, tablets, laptop computers, B2B displays, televisions, and more. Flexible displays offer a unique experience and novel
With the growing demand for electric vehicles and smaller, faster electronic devices, the lithium ion (Li-ion) battery industry is constantly evolving. The need for safer, lighter, and longer-lasting batteries is more pertinent than ever before, and those involved in the manufacturing and formulation of Li-ion components continue to develop innovative solutions that satisfy industry requirements.
Halocarbon engineers and scientists have been working with the leading suppliers in the semiconductor fabrication industry for over a decade. Through next-generation innovation in fluorochemistry, HES has facilitated tremendous progress in the miniaturization of sophisticated semiconductor devices. Understanding the basics of semiconductor fabrication has allowed HES to advance the industry through enhancements in several phases
Photolithography is a microfabrication process that uses light to etch geometric patterns onto a substrate – most often, a silicon wafer. This method inscribes the extremely small patterns of circuits which form the transistors and capacitors powering our electronic devices. Advances in photolithography have played a significant role in the miniaturization of next-generation electronics. As
Atlanta, GA., July, 2019 — Halocarbon Electronic Solutions introduces F3-EMC, or Trifluoroethyl methyl carbonate (Methyl-2,2,2-trifluoroethyl carbonate; 2,2,2-Trifluoroethyl methyl carbonate; FEMC; 3FEMC; or TFEMC, CAS #156783-95-8) for use in Lithium Ion (Li-Ion) batteries. This new product is a linear, partially fluorinated carbonate that serves as a co-solvent to improve the performance of Li-Ion batteries. F3-EMC contains
As technological advancements continue to improve the design complexity and capability of semiconductor instruments, engineers must deliver specially formulated solutions that meet the evolving demands of the industry. With powerful breakthroughs in the hexafluoroisopropyl (HFIP) chemistry field, Halocarbon Electronic Solutions (HES) leads the market in developing new solutions to improve the performance of semiconductor devices.