All posts tagged: Semiconductor Fabrication

Photosensitive Polyimides – Critical for Advanced Semiconductor Packaging

By Jason Spruell Semiconductor Packaging is driving the More than Moore revolution and accelerating the development of ever-powerful electronics. In previous articles, we discussed how advanced polyimides are enabling this More than Moore revolution. Critical to these technologies are photosensitive polyimides.  Polyimides are used as redistribution layer (RDL) dielectrics in the most advanced semiconductor packaging

Advanced Semiconductor Polyimides Enabling More than Moore

Advanced Semiconductor Polyimides Enabling More than Moore

By Jason Spruell Innovative technologies are driving advances in the semiconductor packaging industry resulting in exponential growth of the number input/outputs (I/Os), modular designs for greater economies of scale, thinner and smaller chip packages. The key packaging technology is known as Fan-Out Wafer Level Packaging (FOWLP) in which the input/outputs (I/O) are “fanned-out” from the

More Than Moore Through Advanced Semiconductor Packaging

More than Moore through Advanced Semiconductor Packaging

By Jason Spruell For over 55 years, the semiconductor industry has continued down the path of unrelenting miniaturization as described by Moore’s Law. A majority of this time has been devoted to advancing photolithographic processes to create ever-decreasing feature sizes on logic processors and memory chips. From i-line and 248 nm, to 193 and 193

TFAA- A Semiconductor Solution With Significant Clean-Time Reduction Savings

TFAA: A Semiconductor Solution With Significant Clean-Time Reduction Savings

With growing concerns surrounding the global warming emissions related to semiconductor manufacturing, the electronics industry faces a unique challenge. The demand for more environmentally friendly practices has driven the development of alternatives to traditional materials for use in the removal and cleaning of dielectric films and metal contaminants on the surface of semiconductor wafers. The

Semiconductor Fabrication- How Are They Manufactured

Semiconductor Fabrication: How Are They Manufactured?

Halocarbon engineers and scientists have been working with the leading suppliers in the semiconductor fabrication industry for over a decade. Through next-generation innovation in fluorochemistry, HES has facilitated tremendous progress in the miniaturization of sophisticated semiconductor devices. Understanding the basics of semiconductor fabrication has allowed HES to advance the industry through enhancements in several phases

Hexafluoroisopropyl (HFIP) Chemistry Advances Semiconductor Fabrication

Hexafluoroisopropyl (HFIP) Chemistry Advances Semiconductor Fabrication

Today’s technology-driven economy demands the continued miniaturization of components created by the semiconductor fabrication industry. Specialty fluorochemicals enable the greater functionality of optimized electronic devices. The engineers at Halocarbon Electronic Solutions (HES) utilize their expertise in organofluorine chemistry to provide world-leading semiconductor suppliers with high-performing fluorinated solutions to enhance the semiconductor design and operation. Their